TM 11-6125-240-34
and with contour of lead visible.
maximum contact under circuit board. When soldering,
make certain to completely cover wire lead with solder
Figure 4-13. Forming Component Leads
Dimension B
Dimension A
Reference designation
0.343
1.0
Cl
0.6
C2
0.250
0.6
C3
0.250
0.281
0.8
C4
0.250
0.6
C6
0.250
0.6
C7
0.6
0.250
C8
0.250
0.5
CR1
0.234
0.5
CR2
0.250
0.5
C3
0.5
0.250
CR4
0.234
0.5
CR5
0.5
0.312
CR6
0.5
0.312
CR7
0.312
0.5
CR8
0.250
0.5
CR9
0.912
0.5
CR1O
0250
0.5
CR11
0.6
0.250
R1
0.265
0.8
R2
0.250
0.6
R3
0.250
0.6
R4
4-25